Design Objective:
Redesign a robotic semiconductor assembly system that attaches 352 three-quarter-millimeter spherical lead balls to the surface of a microchip. The goal is to improve speed, reliability, and automation.

Design Solution:
Introduce an automated sprayer to coat the balls in flux and a new pick and place piston assembly to remove the need for secondary processing. Reprogram new ball pickup and release sequences to improve reliability.

Result:
Cycle time was reduced by 50% and the need for operator intervention was further reduced. The robot was also programmed to perform a separate activity that replaced the task of one operator.

Time: 4 month internship
Tools: AutoCAD, Visio, Ladder Logic, BASIC
Team: (engineering intern), engineering mentor